Flip Chip

TF AMD Penang is Flip Chip power house that offers various packages of Assembly and Test including FCBGA, FCPGA & FCLGA.

We are advanced technology factory with world class team, advanced infrastructure and automation capabilities.

We offer Flip Chip assembly and test services for Micro Processor, Graphic Processors, Communication & Set Top Box application. Flip Chip package types cover Single Die Package, Multi-chip Module (MCM), Coreless Substrate Package, Bare Die Package (Lidless Package), Lidded or Heat Spreader Packager and Stiffener Package.

Wafer Level Chip Scale Packaging

TF-AMD focused on developing innovative technologies by offering Wafer Level Chip Scale Packaging (WLCSP) which provides increased functionality, improved thermal performance and finer pitch interconnection to substrate. In order to meet industry demands for turnkey WLCSP products, TF-AMD has offered the service from Wafer Probing and Wafer Back grind as well.

In order to meet industry demands for turnkey WLCSP products, TF-AMD has offered the service from Wafer Probing and Wafer Back grind as well. TF-AMD use fully-automated wafer back grinding equipment to achieve high level of quality for post grind wafer. The process includes wafer backgrinding, die singulation, AOI and packing in tape & Reel. WLCSP are shipped in a Tape and Reel carrier or waffle pack to hand various customer die sorting requirements. In order to deliver the high quality product to customer, TF-AMD implemented 5 site inspection and Open Short Test before Tape and Reel.

Die Prep Services

TF-AMD delivers complete Die Preparation services for wafers 200mm & 300mm. Die Preparation services are offered as part of our turnkey packaging and assembly process or as separate services based on customer needs. With our advanced wafer processing equipment, TF-AMD offers expert backgrinding services for wafer-level packaging.

Final Test

Final Test is a process where IC units will be tested on its reliability and electrical functionality. Final Test process done with the test cell which composed of a handler and a tester. A units will be loaded into a Handler which connected to a Tester. The reliability and functionality of the units will be tested. The signal data result from test site will be sent to tester to determine whether the unit is pass or fail electrically.

Good and bad unit will be segregate to the different bins. Good unit will be determine as finish goods and the bad unit will be study and diagnose by engineer for the failure analysis. Final Test is a very important process, as it can validate and ensure only the passed and good unit been assembly in the next process to avoid any risk of faulty in the final product.

Wafer Sort

Wafer Sort testing is performed during semiconductor device fabrication, The process of wafer testing is to eliminate functional defects die before send for die preparation process or assembly process. Wafer Sort testing process is performed by the test equipment called Wafer Prober and Tester. A wafer will be loaded inside the wafer prober machine carrier and tested electrically by using a set of microscopic contacts or probes called as probe card which connected to a Tester. The failed die will be mark with a small dot of ink.

The result of the testing will be populated in the Wafer Map and it will be used for assembly process for picking the good dies. Wafer Sort test is very important as it can detect and remove the detective dies in the earlier stage and saves the considerable cost of assembly or test the faulty devices in the next process stage.