About Us

TF AMD Microelectronics (Penang) Sdn. Bhd. (formerly known as AMD Export Sdn. Bhd.) with its High Technology Assembly and Test knowhow, have been in Penang since 1972. April 29th of 2016, marks the date when TFME (TongFu Microelectronics 通富微电) closed the transaction by acquiring 85% of AMD stake in two locations, AMD Penang, Malaysia and AMD Suzhou, Jiangsu, China and formed a joint venture called TF AMD Microelectronics (Penang) Sdn. Bhd.

TF AMD Microelectronics (Penang) Sdn. Bhd. providing a few services such as
▪ WLCSP Services
▪ Wafer Backgrind (WBG)
▪ Die Prep Services (DPS)
▪ Final Test
▪ Wafer Sort
and other related services for AMD and its customers.

TF AMD Microelectronics (Penang) Sdn. Bhd. is certified with the ISO9001:2015 Quality Management Systems (QMS) and the ISO14001:2015 Environmental Management Systems (QMS) certifications and comply with the Sony Green Partner Program. Our continue business objective is to be providing A Customer-Preferred World class Leading Semiconductor Assembly and Test capabilities and scale to competing with the rest of the international market and services.

Company Key Milestones

- 1972 -

Starting Up

Back in 1972, the company is one of the 8 "Pioneer" electronics Companies set up in Penang's Free Trade Zone.
- 1996 -

Assembly

Starting Flip Chip package in year 1996.
- 2010 -

Testing

Testing Capability started in year 2010.
❏ Final Test
❏ System level Testing
❏ Stress Test / Burn-in
❏ Repair Operation
❏ Mark & Pack
- 2014 -

Gaming

2014 is where shipping Gaming products began.
That includes shipping of Flagship product of AMD.
- 2016 -

Joint Venture

In 2016, Joint Venture with TFME and renamed as TF-AMD today.
- 2017 -

WS & WLCSP

Wafer sort & WLCSP capability started in year 2017.
- 2018 -

Expansion

New Building expansion completed in January 2018.
That includes:
❏ Expansion with 2 Storeys (Level 1 and 2)
❏ Multi-Chip & Multi-Bin solutions
❏ Fine Pitch CU Pillar enablement
❏ World Class quality
- 2019 -

Acquisition

FSB Acquisition signed off on 27th May 2019.
- 2021 -

TF-AMD Today

TF-AMD produces High Volume advanced 7nm Multi-Chip module & Single-Chip module.
- 2022 -

TF-AMD Further Expansion

From current 2 storey building to 5 storey building and Multistorey Carpark