About Us

Empowering Global Innovation with Cutting-Edge Semiconductor Packaging and Test Solutions

TF-AMD Penang is Innovating Semiconductor Solutions Globally

Welcome To TF-AMD Penang, Where Innovation And Precision Drive Excellence In Semiconductor Manufacturing.

Supported by state-of-the-art facilities and a dedicated team of 4,000+ professionals, we offer comprehensive OSAT services. Our upcoming solutions, including Wafer Bumping (2025) and FOED Advanced Wafer Level Package (2026), are designed to meet the evolving needs of our global clients.

As part of Tongfu Microelectronics (TFME), a global leader in IC Packaging and Testing, we deliver world-class solutions with reliability, efficiency, and excellence, driving the future of technology.

Comprehensive Assembly Services

Comprehensive Assembly Services: Complete assembly solutions, including wafer bumping (2025) and FOED Advanced Wafer Level Package (2026).

Advanced Testing Solutions

Complete testing to ensure performance and reliability.

Customized Solutions

Delivering tailored solutions to meet unique client needs, from high-volume production to specialized applications.

Cutting-Edge Technology

Advanced tools to boost efficiency and reduce costs.

Proven Expertise

Backed by deep industry knowledge and a history of successful projects in semiconductor manufacturing.

Quality Assurance

Ensuring top-tier product integrity and reliability through rigorous quality control and adherence to industry standards.

Customer-Centric Approach

Focused on responsive, flexible, and personalized services to ensure customer satisfaction.

Location

Penang offers strategic advantages with strong infrastructure, skilled talent, and a business-friendly environment.

Mission Vision Statement

VISION

World class provider of advanced semiconductor packaging and test solutions.

MISSION

Develop Excellence advanced packaging, test solutions and execution to service world-wide semiconductor industry.

VALUE

We value Integrity, Customer oriented, Commitment and Innovation through facts, honesty, understanding, and accountability.

A Message From Our General Manager

As a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we are dedicated to advancing technology with a positive societal impact. Our forward-looking plans focus on innovative, sustainable, and inclusive semiconductor assembly and testing solutions. Together, we are building a future where our advancements benefit everyone, creating a brighter and more sustainable world for generations to come.

Thank you for your continued support and partnership. Together, we will achieve great things.

Kwee Swee Lian
General Manager, TFAMD

MESSAGE FROM GENERAL MANAGER

WHAT WE SERVE

We power key markets in the semiconductor industry, from high-performance computing to automotive and consumer electronics, driving innovation that shapes the future.

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About Us

Services

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Empowering Global Innovation with Cutting-Edge Semiconductor Packaging and Test Solutions