Wafer Sort
Chip Probe, also known as wafer testing, is a crucial step in semiconductor manufacturing. This process involves electrically testing silicon dies while they are still in wafer form. By identifying non-functional dies early, Chip Probe helps reduce costs, improve yields, and ensure high-quality products.
Equipment:
Prober
High Throughput and Automation
Precise and Accurate
Data Logging and Yield Analysis
Wafer Handling 8” & 12”
Precise Temperature Control (UTCS+ Chuck)
Tester
Supportable for DC/AC Testing, Mixed Signal Testing, Parametric & Functional Testing
Cost effective high volume testing
Multi-Site Testing
Max IO up to 6912 channels with IO Memory 448mV
Precision Measurement Capabilities
Support for high-performance computing devices, AI chips and other advanced IC
Probe Card
Supportable for multiple docking types (Direct Dock/Pogo Tower)
Touch down monitoring system
In-Line cleaning, deep cleaning activation
Probe card technologies (Pogo/MEMS/Membrane)