Assembly
TF-AMD offers an assembly solution designed to meet high I/O and high electrical performance demands, ideal for chipsets, graphic products, and microprocessor applications where high frequency and high speed are required. The package supports ball/pad counts ranging from 500 to 6096.
The flip chip interconnection method is employed, where the die or chip is flipped over and attached to the substrate. The interconnect is formed once the package undergoes thermal treatment. The solder bump on the substrate or chip can be made of solder or copper pillar.
Flip Chip Packages @ TF-AMD
FCBGA
Single Chip Module
Multi Chip Module
FCLGA
Single Chip Module
Multi Chip Module
2.5D (EOL only)
FCPGA
Single Chip Module
Multi Chip Module
FC-SIP
Flip Chip Packages Capabilities @ TF-AMD
The test criterion is zero defect out of 77 sampling units.
JEDEC Precondition MSL-1：J-STD-20/JESD22-A113
| Package Type | Package Size (mm) | I/O | Substate | Ball Pitch (mm) |
| FCLGA | 40×40 ~ 72×75 | 1718~ 6096 | 5-2-5 to 9-2-9 Layer Laminate | 1 |
| FCBGA | 19×19 ~ 52.5×52.5 | 631 ~2409 | 2-2-2 to 5-2-5 Layer Laminate | 0.6 ~1 |
| HFCBGA | 40×40~ 45×45 | ~1500 | 4-2-4 to 5-2-5 Layer Laminate | 0.6 ~1 |
| FCPGA | 40x40mm | 631 ~2409 | 3-2-3 to 5-2-5 Layer Laminate | 1 |
| FC-SiP | 12x13mm | ~400 | 4-2-4 Layer Laminate | 0.5 |
Features
Substrate build-up layer range, 2-2-2 to 9-2-9
Minimum 150 µm bump pitch for solder bump and minimum 110µm for copper pillar bump
Ball pitch range, 0.6 to 1mm
Heat spreader for high thermal requirement (Optional)
Package sizes from 19 × 19 mm to 80 × 80 mm