Take charge of process control within the designated area, continuously optimizing existing processes to ensure product quality.

Handle equipment faults and execute PM plans to maintain a smooth production workflow.

Implement and verify cost reduction initiatives within the area of responsibility.

Conduct validation work for new processes and materials within the designated area.

Collaborate in the acceptance of newly purchased equipment within responsibility area.

Manage equipment spare parts, including inventory, procurement, and technical verification.

Oversee the management of tools, kits, dummy wafer, and similar resources within the designated area.

Develop various operational manuals and guidelines for tasks within the designated area.

Conduct training and assessments for operational staff within the designated area.

Participate in TPM team activities.

Bachelor’s degree and above in Engineering or related.

Basic English skills and proficiency in MS Office.

Basic knowledge of FMEA and DOE.

Experience in Sputter/Disco Grinding/Wet Etch/Plating/Strip.

Understand SPC principles and possess the ability to perform relevant analyses.

Master quality management knowledge and common analysis tools, including SPC, 8D, DOE, and the seven basic tools of QC.

Familiar with MSA.

Be well-versed in the workflow, understanding process requirements and product quality benchmarks. Also familiar with the materials in use.

Acquire expertise in the performance, operation, and debugging methods of relevant equipment.

Understand electrostatic discharge precautions and requirements.

Strong communication and teamwork skills.