Responsible for technical/administrative/operational leadership of a project/mission within the programmatic guidelines set by the program manager and customer.

Defines, generates and reviews project requirement documentation.

Provides the coordination between resource managers/supervisors and ensures all necessary reviews and approvals are received.

To lead a team of product development engineers to develop and establish assembly processes recipe for new products through process characterization and process parameters optimization.

Drive cost saving and process Cost Of Ownership (COO) improvement through material selection, process cycle time improvement, productivity improvement/innovation.

Drive Yield & Quality KPI improvement through Lean Six Sigma approach.

Program Management of new products introduction.

Required overall packaging process/material understanding and 2nd level analysis skill using statistical tool.

Other duties assigned by superior.

Degree in Engineering (Material/Mechanical/Electrical/Electronic)/Applied Science (Physic) or any relevant education background.

Strong technical background in order to evaluate options, plan directions and mitigate risks to the program.

Superior communication skills (both verbal and written) as well as strong people skills.

Capability to negotiate deliverables, interfaces and development both inside and outside of the team.

Comfortable in an ambiguous environment, must be willing to take risks and must be able to create order out of an unordered world.

Experience managing manufacturing partners throughout the product-life-cycles from NPI bring up to HVM to EOL.

Other Qualifications (Plus Requirements): Knowing of Flip Chip LGA/PGA/BGA processes, min. 5 years work experience as NPI program manager in OSAT (Outsourced Semiconductor Assembly and Test).