Management of product sustaining activities which include driving product performance improvement (yield, test time, quality, etc.) and cost reduction.

Manage the introduction of new products (NPI) and their ramp to volume manufacturing.

Work with the Manufacturing, Design, Quality, and Failure Analysis teams in the disposition of product excursions and manage cases through a material review board.

Manage the engineering activities during new product introduction including product test flow, EVT and DVT engineering activities, generation of buyoff units, and test program readiness before ramping to volume manufacturing.

Manage product ramp to yield entitlement. Drive all margin issues with operations and development teams.

Maintaining good networking with counterpart in China.

Other duties as assigned by Manager.

Bachelor’s degree in Electrical and Electronic Engineering/Computer Engineering or above.

Fluent oral and written skills in Mandarin & English.

At least 5 years or above of related working experience in related fields with sound knowledge of semiconductor digital device testing concepts, semiconductor device fabrication & manufacturing processes.

Product definition, yield analysis, wafer process and semiconductor knowledge, ATE/SLT testing methodology, project management.

Capable of working with cross-functional teams like test & product development team, manufacturing, product planner, quality, and failure analysis.