Failure Analysis and Reliability Test
TF-AMD Penang has an internal Failure Analysis and Reliability Laboratory, dedicated to supporting Flip-Chip products’ package level analysis and testing. A team of experienced engineers and staff conduct precise and careful failure analysis activities using state-of-the-art equipment to deliver reliable results.
Reliability tests are performed based on JEDEC international standards and customer requirements, ensuring comprehensive product evaluation, reliability risk assessments, and reliability monitoring.
Failure Analysis Equipment:
Electrical Fault Isolation
Curve Tracer (Open/Short check)
TDR (Impedance comparison)
Imaging Tools
High Power Scope (Optical inspection)
SEM (Surface morphology inspection)
IR Scope (Die edge inspection)
X-Ray
C-SAM
Material Characterization
Shadow Moiré (warpage with heating)
Surface Profiler (warpage at room temp)
EDX (elemental analysis)
Sample Preparation
Mechanical Cross-section & Polishing
Decap/Chemical Etching
FIB cut
Reliability Test Equipment:
Temperature and Humidity Stress Test (Pre-Cond)
Preconditioning MSL 3, MSL 4
Standard ref: J-STD-020
Reflow
8 heating zones, 2 cooling zones
~10mins per cycle • Standard ref: J-STD-020
High Temperature Storage (HTS)
150degC
Standard ref: JESD22-A103
Temperature Cycle (TC)
TCJ, TCK, TCG (2 cycles/hour)
Standard ref: JESD22-A104
Unbiased HAST (uHAST)
130degC, 85%RH
Standard ref: JESD22-A118