29 Jan 2026, the Memorandum of Understanding (MoU) between Universiti Malaysia Perlis (UniMAP) and TF AMD Microelectronics (Penang) Sdn. Bhd. was formalised as a joint effort to strengthen academic–industry relations based on mutual respect and shared benefits. The MoU was signed by Prof. Dato’ Ts. Dr. Zaliman Sauli, Vice-Chancellor of UniMAP, while TF AMD was represented by Mr. Kwee, SL Managing Director of TF AMD Microelectronics (Penang) Sdn. Bhd.

These partnerships reflect a shared commitment to strengthening industry–academia collaboration, particularly in Advanced Packaging includes talent development, research, and innovation within Malaysia’s semiconductor ecosystem. As a leading industry player, TF-AMD firmly believes that close engagement with academic institutions is essential to nurturing future-ready talent and driving long-term, sustainable technological advancement.

TFAMD confident that this partnership will create a positive impact—not only for TFAMD and UniMAP, but also for the wider industry and the nation’s aspiration to build a strong and resilient semiconductor talent pipeline.

Also present as witness Mr. WuPin Zhong, General Manager TongFu Microelectronics (TFME) Sdn Bhd and Prof. Madya Ir. Ts. Dr. Razaidi Hussin, Dean Faculty of Electronic Engineering & Technology from UniMAP. The ceremony concluded with a group photo session, commemorating the meaningful exchange between TF-AMD and the distinguished representatives from UniMAP.