Pioneering Excellence in Tomorrow’s Technology
2025-2026
Set up Bumping and Advanced Packaging services in TF-AMD Batu Kawan site
2024
Began Assembly & Test Production at the TF-AMD Batu Kawan site
2023
Expanded operations with a new building at Batu Kawan Industrial Park
2022
Further expansion, adding three additional floors to the existing building
2019
Acquired FSB on May 27, 2019
2018
Expanded facilities with a new two-level building
2017
Introduced Wafer Sort & Die Prep capabilities
2016
Formed a Joint Venture between AMD & TFME, rebranded as TF-AMD
2010
Launched Testing Capabilities (FT, SLT, Burn-In)
1996
Launched Flip Chip Package Assembly
1972
Established as AMD, one of the eight pioneer companies in the Penang Free Trade Zone
