On 28 April 2026, the Malaysia Semiconductor Industry Association (MSIA) hosted the SME–MNC Connect Day at MATRADE KL with the theme “Grow Local, Compete Global!”. The event brought together leading multinational corporations and Malaysian SMEs to strengthen collaboration in the semiconductor ecosystem. Officiated by YB Sim Tze Tzin, Deputy Minister of Investment, Trade and Industry, it drew over 170 participants from across the industry.

Representing TF-AMD; ES Tai, Director of Operations ATMP Engineering, delivered a session on “Opportunities, Requirements, and Processes”. The presentation highlighted:

• Supplier Qualification Pathways: Clear expectations for SMEs to meet TF-AMD’s global standards.
• Localisation Opportunities: Emphasis on sourcing and developing local suppliers to strengthen Malaysia’s semiconductor value chain.
• Advanced Packaging Needs: Sharing insights into evolving requirements in assembly and test, aligned with TF-AMD’s leadership in advanced packaging.

The program also featured presentations from Micron, Intel, Texas Instruments, Infineon, Lam Research, SanDisk, and others, alongside expert analyses on advanced packaging trends by Yole Group, Silicon Connect, and NXP Semiconductor. These sessions provided SMEs with direct insights into procurement expectations, vendor onboarding processes, and emerging technology pathways.

Our participation at SME–MNC Connect Day reflects TF-AMD’s leadership in shaping Malaysia’s semiconductor future. By sharing our requirements and collaborating with local SMEs, we are not only strengthening our supply chain but also contributing to Malaysia’s long-term competitiveness in advanced packaging and semiconductor manufacturing.