Year 2023 marked a significant milestone with the completion of a new TF-AMD building in Batu Kawan, Penang. The new facility which spans 1.5 million square feet and covers 5.67 hectares of land is the result of nearly MYR 2 billion in capital investment by TFME.

Set to encompass Bumping, Advanced Packaging and Semiconductor Back-End processes, this new site expansion will significantly boost technological production with its planned transformation into a vertically integrated manufacturing hub which is crucial for end-to-end supply chain orchestration and lean manufacturing optimization. First Product Qualification was kicked off in Oct 2023 and Final Manufacturing have commenced since mid’24. TF-AMD is proud to play a significant role in advancing the Malaysian semiconductor industry.