TF AMD
Shaping the Future, Inspiring Careers
TF-AMD is driving Malaysia’s semiconductor industry forward with breakthrough technologies like Fan Out Process and 2.5D Packaging, essential for high-performance computing (HPC) and AI GPU markets. As Malaysia’s first OSAT developing high-end packages, we’re positioning the nation as a hub for advanced semiconductor production and global investment.
Our Flip Chip expertise spans FCBGA, FCPGA, and FCLGA packages for applications like Microprocessors, GPUs, and Communication Devices. With cutting-edge automation, advanced infrastructure, and a world-class team, TF-AMD Penang thrives on innovation.
Join us to gain hands-on experience with industry-leading technology and contribute to advancements in local and global markets. Whether you’re an engineer, technician, or specialist, TF-AMD offers unparalleled opportunities to grow, innovate, and make an impact.
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